Features
- Cutting-edge programming core delivers the fastest and most stable programming performance on high-density NAND Flash and eMMC
- Full IC pin contact check prevents bad contact in socket or IC damage from reversed placement
- Device supported: UFS, eMMC, eMCP, MCU/MPU, NOR/NAND Flash EEPROM, SPI Memory, FPGA, CPLD, etc.
- Package supported: DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP, etc.
- USB3.1 Gen 1 (USB3.0) transferring interface significantly increase the programming speed
- Intuitive graphical user interface
- Clear display of each function in the entire programming procedure
- Display details and status of each device during programming
- Fast software support by customer’s request
- The supporting software is updated weekly on HI-LO website for checking or retrieving
- All programming problems will be followed and handled immediately