Feature
- Up to 2500 UPH with 4 nozzles
- Equipped with 4 units of ALL-200G or ALL-300G2 programmers. 32-64 devices can be programmed simultaneously
- Minimize the jam rate as well as the possibility of lead bent during handling
- Capable of handling as small as 1.5mm x 1.5mm devices such as WLCSP
- Device supported: UFS, eMMC, eMCP, MCU/MPU, NOR/NAND Flash EEPROM, SPI Memory, FPGA, CPLD, etc.
- Package supported: DIP, SDIP, SOP, SSOP, TSOP, PLCC, QFP, QFN, SON, BGA, WLCSP, etc.
- Arm camera (1.3M pixels) for socket positioning
- Fixed camera (3M pixels) for IC pick & place positioning
- Optional AOI for 2D/3D inspection of IC appearance
- All setup data such as IC type, socket type, and position are saved automatically to achieve zero changeover time
- User friendly operating interface minimize the possibility of misoperation
- Provides detailed information of machine status, production status, warning, etc.
- Detailed production reports and log files are saved for traceability
- Laser displacement sensor: Automated height calibration of picking IC (Z-axis)
- Automated IC pick & place positioning reduces the changeover time to 15 minutes or less
- One-Click Start: Operators can start production simply by scanning the barcode, significantly eliminating human errors
- E-Board: Visualize and update production statistics (Yield rate, UPH, the condition of sockets, etc.) promptly for management to track anytime
- Program Track System(PTS): Completely record every order from end to end throughout the production process and provide valid statistics for management, realizing statistical process control (SPC)
- Support package conversion between tape, tray, and tube